ABB 5SHY4045L0001 3BHB018162R0001

ABB 5SHY4045L0001 3BHB018162R0001 We operate ABB, GE aereration, A-B, Honeywell, KUKA, SCHNEIDER, Bentley, TRICONEX Invensys, WOODWARD, FOXBORO, WESTINGHOUSE, and MOTOROLA MOTOROLA, KEBA, KOLLMORGEN, EMERSON, HIMA dark horse, industrial and commercial energy storage, container energy storage, household light energy storage, (peak cutting, valley filling, backup power supply) can be contacted if necessary. Country of Origin: USA Moq :1 piece Packaging: new raw materials and individual packaging Delivery time :2-3 working days Payment method: Bank transfer, Western Union

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Product Name

ABB 5SHY4045L0001 3BHB018162R0001 Industrial High-Power IGBT Power Module

—— A core component in ABB’s medium-voltage power electronics portfolio, specialized in “4.5kV high-voltage power conversion + 400A heavy-current handling + harsh industrial environment durability”. It is designed for medium-voltage drives, grid rectifiers, static var compensators (SVC), and renewable energy converters (wind/solar).

2. Product Description

The ABB 5SHY4045L0001 3BHB018162R0001 is a high-performance IGBT power module engineered to solve critical challenges in medium-high voltage industrial applications, such as high voltage stress on power devices, inefficient heat dissipation under heavy loads, and poor reliability in grid-disturbance scenarios. Its core functional positioning is as follows:

High-Voltage Heavy-Current Conversion Core: Adopts a single IGBT chip with an integrated anti-parallel freewheeling diode, supporting a rated voltage of 4500V DC and rated current of 400A (continuous conduction at 25℃). It serves as the primary power switching unit in medium-voltage drives (e.g., ABB ACS6000 series) and grid-connected converters, enabling stable AC-DC/DC-AC conversion with an energy efficiency of ≥98.5% at rated load.

Advanced Thermal Management Design: Features a Direct Bonded Copper (DBC) substrate with high thermal conductivity (≥180W/m·K) and a hermetic aluminum alloy package, minimizing thermal resistance (junction-to-case, Rth(j-c)) to ≤0.15℃/W. This design ensures efficient heat transfer to cooling systems (forced air or liquid cooling), keeping the IGBT junction temperature below 125℃ even at 100% continuous load, significantly extending component lifespan.