AMAT 0010-27983

AMAT 0010-27983 We operate ABB, GE aereration, A-B, Honeywell, KUKA, SCHNEIDER, Bentley, TRICONEX Invensys, WOODWARD, FOXBORO, WESTINGHOUSE, and MOTOROLA MOTOROLA, KEBA, KOLLMORGEN, EMERSON, HIMA dark horse, industrial and commercial energy storage, container energy storage, household light energy storage, (peak cutting, valley filling, backup power supply) can be contacted if necessary. Country of Origin: USA Moq :1 piece Packaging: new raw materials and individual packaging Delivery time :2-3 working days Payment method: Bank transfer, Western Union

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AMAT 0010-27983

Product Name

AMAT 0010-27983 300mm MCA E-Chuck ESC Heater Assembly

—— A dedicated thermal control component for semiconductor manufacturing, classified as “electrostatic chuck (ESC) integrated heater” under Applied Materials’ wafer processing portfolio. It is engineered for 300mm (12″) wafer fabrication, combining precision heating with electrostatic adsorption capabilities.

2. Product Description

The AMAT 0010-27983 addresses critical challenges in advanced semiconductor processes, such as uneven wafer temperature distribution during deposition/etching, insufficient thermal stability for thin-film formation, and contamination risks in vacuum environments. Its core functional value is outlined below :

Dual-Function Integration for Wafer Processing: Serves as both a high-precision heater and electrostatic chuck base. The embedded heating elements regulate ESC temperature to ensure consistent thermal conditions across the wafer surface, while the electrostatic adsorption mechanism maintains wafer flatness (≤0.1mm deviation) without mechanical clamping—critical for processes like DLC coating, chemical vapor deposition (CVD), and plasma etching .

Ultra-Uniform Temperature Control: Adopts distributed resistance heating elements (or electrothermal film) integrated into a high-purity ceramic substrate. This design achieves temperature uniformity of ±2℃ across the 300mm wafer area, with rapid heating/cooling rates (≥5℃/s) to support dynamic thermal profiles required for advanced node (≤7nm) chip manufacturing .