H200, RTX4090, RTX5090

H200, RTX4090, RTX5090 We operate ABB, GE aereration, A-B, Honeywell, KUKA, SCHNEIDER, Bentley, TRICONEX Invensys, WOODWARD, FOXBORO, WESTINGHOUSE, and MOTOROLA MOTOROLA, KEBA, KOLLMORGEN, EMERSON, HIMA dark horse, industrial and commercial energy storage, container energy storage, household light energy storage, (peak cutting, valley filling, backup power supply) can be contacted if necessary. Country of Origin: USA Moq :1 piece Packaging: new raw materials and individual packaging Delivery time :2-3 working days Payment method: Bank transfer, Western Union

H200, RTX4090, RTX5090

NVIDIA H200 Data Center GPU Module
1.1 Product Name
NVIDIA H200 Data Center AI/High-Performance Computing (HPC) GPU Module
—— A flagship data center GPU module in NVIDIA’s Hopper architecture lineup, specialized in “large-scale AI model training/inference + high-performance scientific computing + cloud data center workloads”. It is widely used in cloud service providers, enterprise AI labs, and supercomputing centers.
1.2 Product Description
The NVIDIA H200 is a cutting-edge data center GPU module designed to address the growing demand for computing power in AI and HPC scenarios, such as inefficient large-model training, limited memory bandwidth for data-intensive tasks, and poor scalability in distributed systems. Its core functional positioning includes:
  1. AI & HPC Computing Power Hub: Powered by the Hopper architecture (GH100 GPU chip), it features 14,592 CUDA Cores, 456 Tensor Cores (4th generation), and 114 Ray Tracing Cores. It delivers up to 3,351 TFLOPS of FP32 performance, 6,702 TFLOPS of FP16 performance, and 26.8 PFLOPS of Tensor Core performance (FP8), enabling efficient training of large language models (LLMs) with billions of parameters and high-precision scientific simulations (e.g., climate modeling, quantum chemistry).
  1. High-Bandwidth Memory & Scalability: Equipped with 80GB of HBM3 (High-Bandwidth Memory) with a memory bandwidth of 3.35 TB/s, it solves the “memory bottleneck” in data-intensive tasks. Supports NVIDIA NVLink 4.0 (600 GB/s inter-GPU bandwidth) and NVSwitch, enabling seamless connection of up to 256 H200 GPUs in a single system for distributed computing, meeting the needs of ultra-large AI model training.
  1. Energy Efficiency & Data Center Optimization: Adopts a 4nm manufacturing process, achieving a performance-per-watt ratio of up to 1.5x that of previous generations. Supports dynamic power management (TDP: 700W, adjustable based on workload) and NVIDIA AI Enterprise software suite, optimizing resource allocation for cloud and enterprise data centers.
  1. Software Ecosystem Compatibility: Fully compatible with NVIDIA CUDA X AI, TensorRT, and cuDNN libraries, as well as popular AI frameworks (TensorFlow, PyTorch, MXNet). Supports containerization deployment (Docker, Kubernetes) and cloud-native workflows, reducing development and deployment costs for developers.
This module is a cornerstone in data centers for AI innovation, powering applications such as generative AI, autonomous driving algorithm training, and high-performance scientific computing.
1.3 Product Parameters (Key Technical Indicators)

Parameter Category
Specific Specifications
Architecture
NVIDIA Hopper (GH100 GPU chip, 4nm process)
Computing Cores
14,592 CUDA Cores; 456 4th-gen Tensor Cores; 114 Ray Tracing Cores
Performance
FP32: 3,351 TFLOPS; FP16: 6,702 TFLOPS; FP8 Tensor Core: 26.8 PFLOPS; INT8: 53.6 TOPS
Memory Configuration
80GB HBM3; Memory Bandwidth: 3.35 TB/s; Memory Bus Width: 5120-bit
Interconnect
NVLink 4.0 (600 GB/s per GPU, up to 8-way GPU connection); PCIe 5.0 x16 (64 GB/s)
Power & Thermal
TDP: 700W; Cooling: Passive (for server chassis integration) / Active (optional)
Software Support
CUDA 12.x+, TensorRT 8.x+, cuDNN 8.x+; Compatible with TensorFlow, PyTorch, MXNet

1.4 Product Specifications (Physical & Environmental)

Specification Category
Specific Parameters
Form Factor
OCP Accelerator Module (OAM) / PCIe Full-Height Full-Length (FHFL)
Dimensions (FHFL)
336.5mm (length) × 158.75mm (width) × 43.2mm (height)
Weight
Approximately 1.8kg (FHFL form factor)
Operating Temperature
5℃~40℃ (ambient); Storage Temperature: -40℃~70℃
Relative Humidity
20%~80% RH (non-condensing)
Certifications
CE, FCC Class A, UL 60950-1, IEC 60950-1

2. NVIDIA RTX4090 Consumer-Grade Flagship Graphics Module
2.1 Product Name
NVIDIA RTX4090 Consumer-Grade Flagship Graphics Processing Unit (GPU) Module
—— A top-tier consumer graphics module in NVIDIA’s Ada Lovelace architecture, focused on “4K/8K gaming + professional content creation + enthusiast-level AI computing”. It is widely used by gamers, 3D designers, and AI hobbyists.
2.2 Product Description
The NVIDIA RTX4090 is a high-performance consumer graphics module designed to redefine the standards for gaming and content creation, addressing pain points such as low frame rates in 8K gaming, slow 3D rendering, and limited AI acceleration for consumer applications. Its key functions include:
  1. Next-Gen Gaming Performance: Powered by the Ada Lovelace architecture (AD104 GPU chip, 4nm process), it features 16,384 CUDA Cores, 512 4th-gen Tensor Cores, and 128 3rd-gen Ray Tracing Cores. Delivers up to 83.2 TFLOPS of FP32 performance and 191.7 TFLOPS of Ray Tracing performance, enabling smooth 8K/120Hz gaming with real-time ray tracing and DLSS 3 (Deep Learning Super Sampling) technology, significantly enhancing visual quality and frame rates.
  1. Professional Content Creation: Optimized for 3D rendering (Autodesk 3ds Max, Blender), video editing (Adobe Premiere Pro, DaVinci Resolve), and graphic design (Adobe Photoshop). Suppo
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