IC698CHS009A
IC698CHS009A**Allen-Bradley (Rockwell Automation) GE Fanuc RX3i 9-Slot Chassis Backplane Module
Model Interpretation:
- “IC698”: Identifies compatibility with Allen-Bradley’s GE Fanuc RX3i PLC platform, the successor to the Series 90-70 system.
- “CHS”: Abbreviation for “Chassis Backplane,” specifying its role as the interconnect infrastructure for RX3i modules.
- “009A”: Denotes a 9-slot configuration (“009”) with hardware revision “A,” supporting high-speed data transfer between modules.
2. Product Description
The IC698CHS009A is an industrial-grade chassis backplane module engineered by Allen-Bradley for GE Fanuc RX3i programmable logic controllers (PLCs). As the central interconnect component of the RX3i system, its primary function is to:
- Provide a high-speed data bus for communication between the RX3i CPU (e.g., IC698CPU313) and I/O modules (analog, digital, communication);
- Distribute power to all installed modules from a compatible power supply (e.g., IC698PWR330);
- Ensure synchronous operation of modules with deterministic data transfer (≤1ms latency) critical for real-time control applications.
Key technical strengths addressing industrial system demands:
- High-Speed Backplane Bus: Features a 32-bit parallel data bus operating at 33MHz, supporting aggregate data transfer rates up to 132MB/s—enabling rapid exchange of control data between the CPU and I/O modules in high-performance applications (e.g., motion control, precision manufacturing).
- 9-Slot Flexibility: Accommodates up to 9 RX3i modules (1 CPU + 8 I/O/communication modules), providing scalable I/O capacity for systems ranging from small machines to medium-scale process lines—eliminating the need for multiple racks in mid-sized applications.
- Redundant Power Distribution: Supports dual redundant power supplies (when paired with IC698PWR330), with isolated power rails to prevent total system failure if one supply malfunctions—critical for mission-critical applications like chemical batch processing.
- Industrial-Grade Durability: Designed to withstand harsh factory environments with operating temperature range of 0°C~60°C, resistance to vibration (10–500Hz, 2g acceleration per IEC 60068-2-6), and compliance with EN 61000-4 EMC standards—ensuring reliable operation in electrically noisy environments.
- Backward Compatibility: Maintains compatibility with legacy RX3i modules (e.g., IC698MDL645 digital output, IC698ALG220 analog input) while supporting new high-performance modules, protecting existing investments in RX3i infrastructure.
3. Product Parameters
| Parameter Category | Specific Specifications |
|---|---|
| Backplane Performance | Slot Count: 9 (1 CPU slot + 8 I/O/communication slots) ;
Data Bus: 32-bit parallel, 33MHz ; Aggregate Data Transfer Rate: 132MB/s ; Latency: ≤1ms (module-to-CPU data transfer) ; Synchronization: Hardware clock with ±50ppm accuracy for module timing alignment |
| Power Distribution | Power Input: Compatible with RX3i power supplies (e.g., IC698PWR330: 100–240V AC input, 5V DC/12V DC output) ;
Power Rails: +5V DC (logic power), +12V DC (auxiliary power) ; Maximum Power Distribution: 50W (total across all modules) ; Power Protection: Overcurrent protection on +5V rail (resettable fuse, 10A) |
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